10 May 2019, 09:20-10:00
René Rongen graduated in physics at RWTH Aachen (Germany) in 1992. In 1996 he received his PhD degree in physics at Eindhoven University of Technology (The Netherlands). He joined Philips Semiconductors (NXP Semiconductors since October 2006) in 1997.
Since the first day, he is active in reliability physics. During the first years, he was as an engineer responsible for the qualification of various products. After a few years, he became the reliability physics team leader. In 2005, he switched from a manager’s position to an expert role and became the reliability competence manager being responsible for the reliability technology and competence development in the local central Nijmegen lab. In 2008, when he became a technical director, this expert role extended to global NXP. After the merge with Freescale in 2015, he switched to the new corporate engineering team of reliability experts and became a fellow in 2018.
Meanwhile, he is the lead editor of NXP’s Reliability Policy and Requirements, the owner of all product reliability test specs in NXP and the NXP Reliability Knowledge Framework. He is actively representing NXP in several industry standardization bodies and industrial forums like AEC, JEDEC and ZVEI. As such, he contributed, among others, to the latest revision of AEC-Q100 and -Q006, JESD47 and ZVEI Handbook for Robustness Validation.
He is (co-)author of many papers on various topics, including Cu-wire reliability, solder joint reliability and reliability of WL CSP devices. He is regularly visiting reliability relevant conferences and workshops, like IRPS, ESREF, ECTC and AEC-RW, to present papers or as an invited speaker. In addition, he is a technical committee member for ECTC, ESREF and ESTC.